MI6IISP
THE MI6IISP IS A HIGHLY ACCURATE PLACING MODULE THAT CAN PACE A MIX OF PARTS INCLUDING SEMI-CONDUCTORS USING THE SAM TACT TIME AS THE M6S MODULE BUT WITH IMPROVED PLACEMENT QUALITY.
- ACHIEVES HIGH ACCURACY PALCEMENT WITH A PLACING ACCURACY OF ±10 μm.
- A MIXTURE OF BARE DIES(1) AND SMDs (SURFACE MOUNT DEVICE) CAN BE MOUNTED AT THE SAME LINE.
- ALL AVAILABLE NXT II FUNCTIONS AND OPTION UNTILS CAN BE USED WITH THIS MODULE.
NOTE 1: BARE DIES ARE NON-PLASTIC MOLDED SEMI-CONDUCTOR CHIPS THAT ARE CUT FROM A WAFER.
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